tin-lead solder
基本解释
- 锡铅钎料；锡铅焊料
英汉例句
- The present invention is lead-free soldering tin technology, and relates to soldering technology of electronic device and element.
一种无铅焊锡技术，涉及电子元件及器件用焊接用焊锡技术。
ip.com - Many electronics manufacturers will transition their soldering processes from traditional tin-lead alloys to lead-free alloys before 2006.
许多电子制造商将在2006年前从传统的锡铅合金钎焊工艺改变为无铅合金的钎焊工艺。 - The tin electroplating solution exhibits a soldering wettability being comparable with or superior to a conventional tin-lead alloy without the use of hazardous lead or an organic brightening agent.
锡电镀溶液表现出相当于或优于传统锡铅合金（焊料）的焊料润湿性而不使用有害的铅或有机增亮剂。
ip.com